Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
A20-LCG-T-R
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649
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Assmann WSW Components CONN IC DIP SOCKET 20POS GOLD - Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold - Gold 20 (2 x 10) - -
BU200Z-178-HT
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RFQ
3,457
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 20POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 20 (2 x 10) Beryllium Copper Brass
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RFQ
2,636
In-stock
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Gold 20 (2 x 10) Beryllium Copper Beryllium Copper
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RFQ
2,534
In-stock
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Gold 20 (2 x 10) Beryllium Copper Beryllium Copper
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RFQ
1,456
In-stock
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (2 x 10) Beryllium Copper Beryllium Copper