- Series :
-
- 100 (4)
- 101 (1)
- 104 (4)
- 110 (27)
- 111 (4)
- 115 (16)
- 116 (58)
- 121 (4)
- 122 (7)
- 123 (13)
- 124 (4)
- 126 (6)
- 146 (10)
- 210 (2)
- 410 (5)
- 500 (7)
- 501 (2)
- 503 (12)
- 508 (20)
- 511 (2)
- 518 (29)
- 605 (1)
- 612 (6)
- 614 (12)
- 700 (2)
- 714 (1)
- 8 (39)
- 800 (9)
- Correct-A-Chip® 1109800 (1)
- D0 (2)
- D2 (1)
- D26 (1)
- D95 (1)
- Diplomate DL (11)
- Edge-Grip™, C91 (1)
- ICA (2)
- ICO (1)
- Lo-PRO®file, 513 (15)
- OEM (1)
- SA (2)
- WMS (1)
- XR2 (3)
- Part Status :
- Packaging :
- Operating Temperature :
- Termination :
- Features :
-
- Carrier, Closed Frame (3)
- Carrier, Open Frame (19)
- Closed Frame (56)
- Closed Frame, Elevated (39)
- Closed Frame, Seal Tape (2)
- Elevated, Open Frame (59)
- Open Frame (167)
- Open Frame, Decoupling Capacitor (7)
- Open Frame, No Center Bar (2)
- Open Frame, Seal Tape (1)
- Open Frame, Wash Away (1)
- Programmable (1)
- Spacer (1)
- Type :
-
- DIP, 0.1" (2.54mm) Row Spacing (1)
- DIP, 0.2" (5.08mm) Row Spacing (10)
- DIP, 0.3" (7.62mm) Row Spacing (236)
- DIP, 0.4" (10.16mm) Row Spacing (84)
- DIP, 0.6" (15.24mm) Row Spacing (16)
- DIP, 0.9" (22.86mm) Row Spacing (9)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (1)
- Zig-Zag, Left Stackable (3)
- Zig-Zag, Right Stackable (2)
- Housing Material :
-
- Aluminum Alloy (2)
- Plastic (1)
- Polyamide (PA46), Nylon 4/6 (4)
- Polyamide (PA46), Nylon 4/6, Glass Filled (118)
- Polybutylene Terephthalate (PBT) (3)
- Polybutylene Terephthalate (PBT), Glass Filled (4)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (4)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (77)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (105)
- Polyester (9)
- Polyester, Glass Filled (3)
- Polyether Imide (PEI), Glass Filled (1)
- Polyphenylene Sulfide (PPS), Glass Filled (4)
- Thermoplastic (6)
- Thermoplastic, Glass Filled (9)
- Thermoplastic, Polyester (6)
- Thermoplastic, Polyester, Glass Filled (2)
- Contact Finish - Post :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
362 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
VIEW |
876
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||||
VIEW |
806
In-stock
|
3M | CONN IC DIP SOCKET ZIF 20POS GLD | OEM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Gold | 20 (2 x 10) | Beryllium Copper | 250.0µin (6.35µm) | Beryllium Copper | ||||
VIEW |
996
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
2,436
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | Gold | 20 (2 x 10) | - | - | - | ||||
VIEW |
3,122
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | ||||
VIEW |
3,167
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | ||||
VIEW |
1,869
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 20 (2 x 10) | Copper Alloy | - | - | ||||
VIEW |
3,705
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 20 (2 x 10) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | ||||
VIEW |
3,019
In-stock
|
3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 20 (2 x 10) | Beryllium Copper | Flash | Brass | ||||
VIEW |
2,281
In-stock
|
3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 20 (2 x 10) | Beryllium Copper | Flash | Brass | ||||
VIEW |
1,989
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||||
VIEW |
814
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 20 (2 x 10) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | ||||
VIEW |
1,214
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | ||||
VIEW |
3,453
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | ||||
VIEW |
3,886
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
649
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 20 (2 x 10) | - | - | - | ||||
VIEW |
2,582
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
2,289
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
863
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
2,050
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | ||||
VIEW |
2,762
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
1,833
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
2,065
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | ||||
VIEW |
3,787
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | ||||
VIEW |
1,701
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||||
VIEW |
3,926
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 20 (2 x 10) | Beryllium Copper | 25.0µin (0.63µm) | Copper | ||||
VIEW |
2,265
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 20 (2 x 10) | Beryllium Copper | 20.0µin (0.51µm) | Copper | ||||
VIEW |
664
In-stock
|
3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 20 (2 x 10) | Beryllium Copper | Flash | Brass | ||||
VIEW |
3,154
In-stock
|
3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 20 (2 x 10) | Beryllium Copper | Flash | Brass | ||||
VIEW |
2,632
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy |