- Part Status :
- Mounting Type :
- Termination :
- Features :
- Contact Finish Thickness - Mating :
- Contact Finish Thickness - Post :
- Applied Filters :
11 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
996
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,886
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,582
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,289
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
912
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,610
In-stock
|
CNC Tech | CONN IC DIP SOCKET 20POS GOLD | - | Active | Tube | -40°C ~ 105°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | - | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,487
In-stock
|
CNC Tech | CONN IC DIP SOCKET 20POS GOLD | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | - | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
657
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Active | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,644
In-stock
|
On Shore Technology Inc. | CONN IC DIP SOCKET 20POS GOLD | SA | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Gold | 20 (2 x 10) | Beryllium Copper | 80.0µin (2.03µm) | Brass | |||
|
VIEW |
3,660
In-stock
|
On Shore Technology Inc. | CONN IC DIP SOCKET 20POS GOLD | WMS | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame, Wash Away | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | Flash | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,710
In-stock
|
On Shore Technology Inc. | CONN IC DIP SOCKET 20POS GOLD | SA | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
