Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,573
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Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
2-640464-4
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3,122
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 20 (2 x 10) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
C9120-00
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3,167
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Aries Electronics CONN IC DIP SOCKET 20POS GOLD Edge-Grip™, C91 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (2 x 10) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,989
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (2 x 10) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
1825094-6
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1,214
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 20 (2 x 10) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
1825093-6
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3,453
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 20 (2 x 10) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
2-641602-4
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2,050
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 20 (2 x 10) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
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3,787
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 20 (2 x 10) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
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1,701
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (2 x 10) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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2,805
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 20 (2 x 10) Beryllium Copper - Brass