- Series :
-
- 100 (4)
- 110 (14)
- 114 (8)
- 115 (4)
- 116 (24)
- 121 (1)
- 122 (2)
- 123 (2)
- 124 (1)
- 146 (4)
- 299 (6)
- 500 (3)
- 508 (8)
- 518 (15)
- 612 (2)
- 614 (4)
- 8 (38)
- 800 (3)
- BU-178HT (1)
- Correct-A-Chip® 1109800 (1)
- D0 (2)
- D2 (1)
- D26 (1)
- D39 (1)
- D95 (1)
- DPF3 (1)
- ICA (5)
- ICO (4)
- Lo-PRO®file, 513 (20)
- SA (2)
- Vertisockets™ 800 (12)
- WMS (1)
- XR2 (1)
- Part Status :
- Operating Temperature :
- Termination :
- Housing Material :
-
- Plastic (1)
- Polyamide (PA46), Nylon 4/6 (4)
- Polyamide (PA46), Nylon 4/6, Glass Filled (91)
- Polybutylene Terephthalate (PBT) (4)
- Polybutylene Terephthalate (PBT), Glass Filled (2)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (5)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (73)
- Polyester, Glass Filled (9)
- Polyphenylene Sulfide (PPS), Glass Filled (4)
- Thermoplastic (1)
- Thermoplastic, Polyester (7)
- Thermoplastic, Polyester, Glass Filled (2)
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Applied Filters :
208 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,060
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,435
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,478
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 8POS TIN-LEAD | DPF3 | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,676
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 800 | Obsolete | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 8 (2 x 4) | Copper Alloy | - | Brass | |||
|
|
VIEW |
1,512
In-stock
|
3M | CONN IC DIP SOCKET 8POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 8 (2 x 4) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
1,154
In-stock
|
3M | CONN IC DIP SOCKET 8POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 8 (2 x 4) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
726
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | 500 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,111
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | - | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
774
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 500 | Obsolete | - | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,556
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | 800 | Obsolete | Tube | - | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | - | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,114
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | - | Obsolete | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Gold | 8 (2 x 4) | Beryllium Copper | 5.00µin (0.127µm) | Brass | |||
|
|
VIEW |
874
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | - | Obsolete | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Flash | Gold | 8 (2 x 4) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
1,877
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | - | Obsolete | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 30.0µin (0.76µm) | Brass | |||
|
|
VIEW |
1,956
In-stock
|
3M | CONN IC DIP SOCKET 8POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 8 (2 x 4) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
2,323
In-stock
|
3M | CONN IC DIP SOCKET 8POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 8 (2 x 4) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
2,471
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 8 (2 x 4) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,769
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,551
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,234
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,195
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,822
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,755
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,014
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,008
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,483
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,034
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,366
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,069
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,421
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,793
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
