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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
GLOBAL STOCKS
	211-1-08-003	RFQ VIEW	PDF RFQ	1,119 In-stock	CNC Tech	CONN IC DIP SOCKET 8POS GOLD		-	Active	Tube	-55°C ~ 105°C	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polybutylene Terephthalate (PBT)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Brass
	08-3503-30	RFQ VIEW	PDF RFQ	2,732 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	08-3503-20	RFQ VIEW	PDF RFQ	2,159 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	08-1508-30	RFQ VIEW	PDF RFQ	3,844 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Brass
	08-1508-20	RFQ VIEW	PDF RFQ	3,718 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Brass
	08-2503-20	RFQ VIEW	PDF RFQ	3,331 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	ICA-308-SST-H	RFQ VIEW	PDF RFQ	2,340 In-stock	Samtec Inc.	CONN IC DIP SOCKET 8POS GOLD		ICA	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyester, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	-	Brass
	08-2503-30	RFQ VIEW	PDF RFQ	3,213 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	08-6503-30	RFQ VIEW	PDF RFQ	2,363 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	08-6503-20	RFQ VIEW	PDF RFQ	1,545 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	ICA-308-SST	RFQ VIEW	PDF RFQ	882 In-stock	Samtec Inc.	CONN IC DIP SOCKET 8POS GOLD		ICA	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyester, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	-	Brass

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