- Applied Filters :
5 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||
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VIEW |
1,101
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 57 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 36 (2 x 18) | Beryllium Copper | |||
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VIEW |
1,308
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 36 (2 x 18) | Beryllium Copper | |||
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VIEW |
1,971
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 36 (2 x 18) | Beryllium Copper | |||
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|
VIEW |
1,768
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 36 (2 x 18) | Beryllium Copper | |||
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VIEW |
3,350
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 36 (2 x 18) | Beryllium Copper | |||
