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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Material - Post
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	32-C300-30	RFQ VIEW	PDF RFQ	1,373 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	32 (2 x 16)	Beryllium Copper	Brass
	32-C300-20	RFQ VIEW	PDF RFQ	2,238 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	32 (2 x 16)	Beryllium Copper	Brass
	32-C212-30	RFQ VIEW	PDF RFQ	3,500 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	32 (2 x 16)	Beryllium Copper	Brass
	32-C212-20	RFQ VIEW	PDF RFQ	3,167 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	32 (2 x 16)	Beryllium Copper	Brass
	32-C182-30	RFQ VIEW	PDF RFQ	2,607 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	32 (2 x 16)	Beryllium Copper	Brass
	32-C182-20	RFQ VIEW	PDF RFQ	1,433 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	32 (2 x 16)	Beryllium Copper	Brass
	32-6508-302	RFQ VIEW	PDF RFQ	1,179 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	32 (2 x 16)	Beryllium Copper	Brass
	32-6508-202	RFQ VIEW	PDF RFQ	681 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	32 (2 x 16)	Beryllium Copper	Brass
	32-6508-301	RFQ VIEW	PDF RFQ	752 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	32 (2 x 16)	Beryllium Copper	Brass
	32-6508-201	RFQ VIEW	PDF RFQ	3,088 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	32 (2 x 16)	Beryllium Copper	Brass
	32-6508-30	RFQ VIEW	PDF RFQ	3,857 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	32 (2 x 16)	Beryllium Copper	Brass
	32-6508-20	RFQ VIEW	PDF RFQ	3,070 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	32 (2 x 16)	Beryllium Copper	Brass
	32-6503-30	RFQ VIEW	PDF RFQ	2,772 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	32 (2 x 16)	Beryllium Copper	Phosphor Bronze
	32-6503-20	RFQ VIEW	PDF RFQ	755 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	32 (2 x 16)	Beryllium Copper	Phosphor Bronze
	32-6501-20	RFQ VIEW	PDF RFQ	3,047 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS TIN		501	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	32 (2 x 16)	Phosphor Bronze	Phosphor Bronze

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