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33 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
2,539
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | - | Beryllium Copper | |||
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VIEW |
1,373
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Tin-Lead | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | |||
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VIEW |
849
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | Tin-Lead | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | |||
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VIEW |
1,359
In-stock
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Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 32 (2 x 16) | Brass | 200.0µin (5.08µm) | Brass | |||
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VIEW |
944
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
1,684
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 101 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
3,351
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
1,237
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame, Decoupling Capacitor | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
2,809
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,069
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
1,332
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
2,159
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
1,628
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
2,665
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 146 | Active | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
1,096
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,962
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,959
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
2,075
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
2,025
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Tin-Lead | 32 (2 x 16) | Copper Alloy | - | Copper Alloy | |||
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VIEW |
2,322
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS TINLEAD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
2,711
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 146 | Active | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,781
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,402
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 111 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,091
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
729
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TINLEAD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame, No Center Bar | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | 60.0µin (1.52µm) | Tin-Lead | 32 (2 x 16) | Phosphor Bronze | 60.0µin (1.52µm) | Brass, Copper | |||
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VIEW |
2,700
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | Flash | Tin-Lead | 32 (2 x 16) | Copper Alloy | - | Copper Alloy | |||
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VIEW |
3,421
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS TINLEAD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
2,651
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Tin-Lead | 32 (2 x 16) | Copper Alloy | - | Copper Alloy | |||
|
VIEW |
3,070
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 32POS TINLEAD | DILB | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA), Nylon | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Tin-Lead | 32 (2 x 16) | Copper Alloy | 100.0µin (2.54µm) | Copper Alloy | |||
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VIEW |
2,889
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 614 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy |