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- 3M (10)
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- Aries Electronics (89)
- Assmann WSW Components (8)
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- Mill-Max Manufacturing Corp. (52)
- Omron Electronics Inc-EMC Div (4)
- On Shore Technology Inc. (4)
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- TE Connectivity AMP Connectors (40)
- TE Connectivity Potter & Brumfield Relays (1)
- Series :
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- - (229)
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- Polybutylene Terephthalate (PBT), Glass Filled (9)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (4)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (59)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (68)
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296 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | |||||||||||||||||||||||
VIEW |
1,455
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
2,539
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | - | Beryllium Copper | ||||
VIEW |
1,026
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Cut Tape (CT) | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
2,320
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Tape & Reel (TR) | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
1,137
In-stock
|
TE Connectivity Potter & Brumfield Relays | CONN IC DIP SOCKET 32POS TINLEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | 32 (2 x 16) | Copper Alloy | - | - | ||||
VIEW |
1,382
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 32POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,888
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 400 | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 32 (2 x 16) | - | 8.00µin (0.203µm) | - | ||||
VIEW |
1,262
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 32 (2 x 16) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | ||||
VIEW |
3,201
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 32 (2 x 16) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | ||||
VIEW |
1,224
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | 32 (2 x 16) | Copper Alloy | - | - | ||||
VIEW |
1,373
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
2,183
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 32 (2 x 16) | Beryllium Copper | Flash | Brass | ||||
VIEW |
3,440
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 32 (2 x 16) | Beryllium Copper | Flash | Brass | ||||
VIEW |
960
In-stock
|
3M | CONN IC DIP SOCKET 32POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
2,809
In-stock
|
3M | CONN IC DIP SOCKET 32POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
2,428
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 32POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
1,702
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 32POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
2,592
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 32 (2 x 16) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | ||||
VIEW |
966
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||||
VIEW |
3,389
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | Diplomate DL | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Beryllium Copper | - | Beryllium Copper | ||||
VIEW |
1,350
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
849
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
1,359
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Brass | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,946
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
944
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
1,525
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,875
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,944
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 32POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | 32 (2 x 16) | - | - | - | ||||
VIEW |
1,025
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 32 (2 x 16) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | ||||
VIEW |
2,466
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 400 | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 32 (2 x 16) | - | 8.00µin (0.203µm) | - |