Contact Finish - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,094
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
2-382719-1
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3,215
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 30POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 30 (2 x 15) Beryllium Copper - Beryllium Copper
2-382714-1
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2,279
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 20 (2 x 10) Beryllium Copper - Beryllium Copper
2-382712-1
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3,477
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 16 (2 x 8) Beryllium Copper - Beryllium Copper
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1,455
In-stock
Assmann WSW Components CONN IC DIP SOCKET 32POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Tin - 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,044
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Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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2,924
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CNC Tech CONN IC DIP SOCKET 48POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 48 (2 x 24) Phosphor Bronze 100.0µin (2.54µm) Phosphor Bronze
1-390262-3
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1,026
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN - Obsolete Cut Tape (CT) -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin - 32 (2 x 16) Phosphor Bronze - Phosphor Bronze
1-390262-3
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2,320
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN - Obsolete Tape & Reel (TR) -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin - 32 (2 x 16) Phosphor Bronze - Phosphor Bronze
AR48-HZL-TT
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993
In-stock
Assmann WSW Components CONN IC DIP SOCKET 48POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR40-HZL-TT
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3,203
In-stock
Assmann WSW Components CONN IC DIP SOCKET 40POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR28-HZL-TT
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2,541
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Assmann WSW Components CONN IC DIP SOCKET 28POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR24-HZL-TT
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RFQ
2,967
In-stock
Assmann WSW Components CONN IC DIP SOCKET 24POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR40-HZW/T
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3,115
In-stock
Assmann WSW Components CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR28-HZW/T
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RFQ
2,987
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
C8140-04
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2,107
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Aries Electronics CONN IC DIP SOCKET 40POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8128-04
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1,099
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Aries Electronics CONN IC DIP SOCKET 28POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8124-04
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3,376
In-stock
Aries Electronics CONN IC DIP SOCKET 24POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 24 (2 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
1,964
In-stock
Aries Electronics CONN IC DIP SOCKET 48POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,897
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
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RFQ
3,492
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,449
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,947
In-stock
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 44 (2 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,242
In-stock
Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,069
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,382
In-stock
Amphenol FCI CONN IC DIP SOCKET 32POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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915
In-stock
Amphenol FCI CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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2,500
In-stock
Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
4-382568-0
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3,410
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 40 (2 x 20) Phosphor Bronze - Phosphor Bronze
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RFQ
1,749
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper - Beryllium Copper