Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
2,498
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,079
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,097
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,830
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,549
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,074
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
647
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,847
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,408
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,769
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,470
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,045
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze