Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
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666
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Aries Electronics CONN IC DIP SOCKET 10POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze Phosphor Bronze
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2,425
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze Phosphor Bronze
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1,188
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Aries Electronics CONN IC DIP SOCKET 10POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze Phosphor Bronze
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3,259
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze Phosphor Bronze
10-6513-10T
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RFQ
3,061
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper Brass
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RFQ
3,784
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash 10 (2 x 5) Beryllium Copper Brass
612-87-610-41-001101
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RFQ
1,732
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash 10 (2 x 5) Beryllium Copper Brass
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3,976
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash 10 (2 x 5) Beryllium Copper Brass
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RFQ
2,667
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze Phosphor Bronze
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RFQ
3,857
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper Phosphor Bronze
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RFQ
1,178
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper Phosphor Bronze
10-6513-10H
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RFQ
3,026
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper Brass
10-6513-10
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RFQ
2,839
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper Brass
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RFQ
1,796
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 10 (2 x 5) Beryllium Copper Brass
612-83-610-41-001101
RFQ
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RFQ
2,787
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 10 (2 x 5) Beryllium Copper Brass
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RFQ
1,097
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 10 (2 x 5) Beryllium Copper Brass
10-6810-90C
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RFQ
3,208
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 10 (2 x 5) Beryllium Copper Brass
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RFQ
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RFQ
1,615
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze Phosphor Bronze
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RFQ
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RFQ
2,810
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 10 (2 x 5) Beryllium Copper Brass
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RFQ
3,105
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 10 (2 x 5) Beryllium Copper Brass
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RFQ
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RFQ
1,726
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 10 (2 x 5) Beryllium Copper Brass
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RFQ
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RFQ
3,163
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze Phosphor Bronze
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RFQ
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RFQ
1,399
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze Phosphor Bronze
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RFQ
701
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze Phosphor Bronze