- Series :
-
- - (160)
- 100 (3)
- 101 (1)
- 110 (24)
- 111 (3)
- 114 (5)
- 115 (9)
- 116 (29)
- 210 (5)
- 214 (2)
- 299 (4)
- 4800 (2)
- 500 (10)
- 511 (2)
- 518 (14)
- 612 (2)
- 614 (7)
- 6556 (2)
- 6621 (1)
- 700 (1)
- 8 (15)
- 800 (9)
- BU-178HT (1)
- D2 (2)
- D95 (2)
- DILB (1)
- Diplomate DL (11)
- ED (1)
- EJECT-A-DIP™ (11)
- ICO (3)
- Lo-PRO®file, 513 (5)
- SA (2)
- Vertisockets™ 800 (5)
- WMS (1)
- XR2 (3)
- Part Status :
- Packaging :
- Housing Material :
-
- Aluminum Alloy (1)
- Plastic (2)
- Polyamide (PA), Nylon (1)
- Polyamide (PA46), Nylon 4/6 (2)
- Polyamide (PA46), Nylon 4/6, Glass Filled (52)
- Polybutylene Terephthalate (PBT) (5)
- Polybutylene Terephthalate (PBT), Glass Filled (9)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (2)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (48)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (52)
- Polyester (8)
- Polyester, Glass Filled (5)
- Polyphenylene Sulfide (PPS), Glass Filled (5)
- Thermoplastic (4)
- Thermoplastic, Glass Filled (7)
- Thermoplastic, Polyester (6)
- Thermoplastic, Polyester, Glass Filled (2)
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
218 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
2,091
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 24 (2 x 12) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
2,967
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,285
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 24 (2 x 12) | Beryllium Copper | 15.0µin (0.38µm) | Beryllium Copper | |||
|
VIEW |
915
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,042
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 24 (2 x 12) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
2,375
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
3,122
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 24 (2 x 12) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
VIEW |
2,072
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS TINLEAD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | 24 (2 x 12) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
2,807
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | - | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 24 (2 x 12) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
2,054
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 24 (2 x 12) | Beryllium Copper | Flash | Brass | |||
|
VIEW |
1,985
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 24 (2 x 12) | Beryllium Copper | Flash | Brass | |||
|
VIEW |
2,668
In-stock
|
3M | CONN IC DIP SOCKET 24POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
969
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | 24 (2 x 12) | - | - | - | |||
|
VIEW |
2,286
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,977
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,361
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
1,734
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
1,282
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Brass | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
839
In-stock
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 24 (2 x 12) | Beryllium Copper | 29.5µin (0.75µm) | Beryllium Copper | |||
|
VIEW |
3,065
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 24 (2 x 12) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
614
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
1,484
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
2,015
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
1,515
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | 24 (2 x 12) | Beryllium Copper | Flash | Nickel | |||
|
VIEW |
3,557
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | 24 (2 x 12) | Beryllium Copper | 25.0µin (0.63µm) | Nickel | |||
|
VIEW |
3,538
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 24 (2 x 12) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
VIEW |
1,098
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 24 (2 x 12) | Beryllium Copper | Flash | Brass | |||
|
VIEW |
753
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,928
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 614 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
816
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy |