- Part Status :
- Operating Temperature :
- Termination :
- Features :
- Housing Material :
-
- Polyamide (PA46), Nylon 4/6 (1)
- Polyamide (PA46), Nylon 4/6, Glass Filled (51)
- Polybutylene Terephthalate (PBT) (1)
- Polybutylene Terephthalate (PBT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (3)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (1)
- Polyester, Glass Filled (1)
- Thermoplastic (1)
- Thermoplastic, Polyester (2)
- Contact Finish - Post :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
63 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,044
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
800
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
915
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,977
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,282
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,687
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,856
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,087
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,778
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
612
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,656
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,124
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 110 | Active | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
VIEW |
2,510
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
2,872
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
835
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,093
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,349
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,591
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
859
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,064
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,337
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,921
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,281
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,692
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,182
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
1,806
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,108
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,879
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,581
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,199
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
