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14 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
1,845
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
1,707
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
3,899
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
3,035
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,108
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,027
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
756
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
862
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,984
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 36POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
3,374
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 36POS GOLD | D0 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 36 (2 x 18) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
2,052
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
2,030
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
2,778
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
2,394
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
