- Packaging :
- Operating Temperature :
- Termination :
- Housing Material :
-
- Liquid Crystal Polymer (LCP) (5)
- Polyamide (PA), Nylon (2)
- Polyamide (PA46), Nylon 4/6 (37)
- Polyamide (PA46), Nylon 4/6, Glass Filled (66)
- Polybutylene Terephthalate (PBT) (8)
- Polybutylene Terephthalate (PBT), Glass Filled (19)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (22)
- Polyester (2)
- Polyester, Glass Filled (15)
- Thermoplastic, Glass Filled (10)
- Thermoplastic, Polyester (7)
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (2 x 5) (9)
- 12 (2 x 6) (4)
- 14 (2 x 7) (5)
- 16 (2 x 8) (6)
- 18 (2 x 9) (15)
- 20 (2 x 10) (6)
- 22 (2 x 11) (5)
- 24 (2 x 12) (20)
- 26 (2 x 13) (2)
- 28 (2 x 14) (29)
- 30 (2 x 15) (5)
- 32 (2 x 16) (24)
- 34 (2 x 17) (5)
- 36 (2 x 18) (5)
- 38 (2 x 19) (5)
- 40 (2 x 20) (28)
- 42 (2 x 21) (3)
- 48 (2 x 24) (10)
- 8 (2 x 4) (7)
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
193 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
663
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,260
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 34POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 34 (2 x 17) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,518
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 40 (2 x 20) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,970
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 38POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 38 (2 x 19) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,759
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 36 (2 x 18) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,236
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 28 (2 x 14) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,900
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 38POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 38 (2 x 19) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,869
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
2,845
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 32 (2 x 16) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,794
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 24 (2 x 12) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,237
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 30POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (2 x 15) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,102
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 40 (2 x 20) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
949
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 40 (2 x 20) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,960
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 40 (2 x 20) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
988
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,499
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 26POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (2 x 13) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,027
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 22 (2 x 11) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,653
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 18 (2 x 9) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,876
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 14 (2 x 7) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
738
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 38POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 38 (2 x 19) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,045
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 38POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 38 (2 x 19) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,607
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,243
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 40POS TIN | iCF | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Liquid Crystal Polymer (LCP) | 0.100" (2.54mm) | Tin | - | Tin | 40 (2 x 20) | Beryllium Copper | - | Beryllium Copper | |||
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|
VIEW |
2,024
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,335
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 36 (2 x 18) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,731
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 36 (2 x 18) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,541
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 36 (2 x 18) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
666
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 10 (2 x 5) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
882
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 32 (2 x 16) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,483
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | - | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Tin | 32 (2 x 16) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
