Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
3,385
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,700
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 121 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
753
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
666
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,121
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,518
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,928
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,650
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,766
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
210-13-624-41-001000
RFQ
VIEW
RFQ
816
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,921
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 146 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,435
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,146
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,450
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,398
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-624-41-105000
RFQ
VIEW
RFQ
2,941
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,218
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
614-93-624-31-012000
RFQ
VIEW
RFQ
1,824
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,478
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
123-13-624-41-001000
RFQ
VIEW
RFQ
2,083
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
299-93-624-10-002000
RFQ
VIEW
RFQ
2,813
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
796
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 146 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,432
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 101 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-13-624-41-801000
RFQ
VIEW
RFQ
1,035
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-93-624-41-801000
RFQ
VIEW
RFQ
958
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
123-93-624-41-001000
RFQ
VIEW
RFQ
2,736
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
111-43-624-41-001000
RFQ
VIEW
RFQ
3,549
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-13-624-41-001000
RFQ
VIEW
RFQ
1,515
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-43-624-41-001000
RFQ
VIEW
RFQ
686
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-624-41-001000
RFQ
VIEW
RFQ
934
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy