- Manufacture :
-
- 3M (40)
- Amphenol FCI (13)
- Aries Electronics (173)
- Assmann WSW Components (51)
- CNC Tech (33)
- Harwin Inc. (18)
- Mill-Max Manufacturing Corp. (271)
- Omron Electronics Inc-EMC Div (11)
- On Shore Technology Inc. (19)
- Preci-Dip (271)
- Samtec Inc. (28)
- TE Connectivity AMP Connectors (133)
- TE Connectivity Potter & Brumfield Relays (1)
- Series :
-
- - (917)
- 100 (11)
- 101 (4)
- 104 (18)
- 110 (150)
- 111 (16)
- 114 (37)
- 115 (66)
- 117 (60)
- 121 (18)
- 122 (27)
- 123 (43)
- 124 (18)
- 126 (27)
- 127 (14)
- 146 (44)
- 400 (6)
- 4800 (12)
- 508 (52)
- 518 (61)
- 6556 (60)
- 800 (66)
- BU-178HT (5)
- D0 (7)
- D2 (7)
- D26 (4)
- DILB (3)
- Diplomate DL (48)
- ED (4)
- IC (2)
- ICA (12)
- iCF (5)
- ICO (20)
- SA (10)
- XR2 (11)
- Part Status :
- Packaging :
- Termination :
- Housing Material :
-
- Liquid Crystal Polymer (LCP) (5)
- Plastic (7)
- Polyamide (PA), Nylon (5)
- Polyamide (PA46), Nylon 4/6, Glass Filled (113)
- Polybutylene Terephthalate (PBT) (28)
- Polybutylene Terephthalate (PBT), Glass Filled (41)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (13)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (275)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (279)
- Polyester (43)
- Polyester, Glass Filled (43)
- Polyphenylene Sulfide (PPS), Glass Filled (71)
- Thermoplastic (29)
- Thermoplastic, Glass Filled (33)
- Thermoplastic, Polyester (36)
- Thermoplastic, Polyester, Glass Filled (11)
- Pitch - Mating :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
-
- 10.0µin (0.25µm) (262)
- 100.0µin (2.54µm) (27)
- 135.0µin (3.43µm) (4)
- 15.0µin (0.38µm) (22)
- 20.0µin (0.51µm) (14)
- 25.0µin (0.63µm) (35)
- 29.5µin (0.75µm) (147)
- 30.0µin (0.76µm) (399)
- 35.4µin (0.90µm) (10)
- 5.00µin (0.127µm) (5)
- 60.0µin (1.52µm) (48)
- 78.7µin (2.00µm) (5)
- 8.00µin (0.203µm) (23)
- Flash (190)
- Number of Positions or Pins (Grid) :
-
- 10 (2 x 5) (6)
- 16 (2 x 8) (1)
- 18 (2 x 9) (4)
- 20 (2 x 10) (7)
- 24 (2 x 12) (153)
- 28 (2 x 14) (198)
- 30 (2 x 15) (1)
- 32 (2 x 16) (169)
- 36 (2 x 18) (56)
- 40 (2 x 20) (172)
- 42 (2 x 21) (73)
- 44 (2 x 22) (8)
- 48 (1 x 24) (1)
- 48 (2 x 24) (105)
- 50 (2 x 25) (37)
- 52 (2 x 26) (42)
- 56 (2 x 28) (7)
- 6 (2 x 3) (2)
- 64 (2 x 32) (11)
- 68 (2 x 34) (8)
- 8 (2 x 4) (1)
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
1062 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,094
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,215
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 30POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 30 (2 x 15) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
2,279
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
3,477
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 16 (2 x 8) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
1,455
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,243
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TINLEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 28 (2 x 14) | Copper Alloy | - | Copper Alloy | |||
|
VIEW |
2,091
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 24 (2 x 12) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
2,801
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Tin-Lead | 40 (2 x 20) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
2,539
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
1,044
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
2,924
In-stock
|
CNC Tech | CONN IC DIP SOCKET 48POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Tin | 48 (2 x 24) | Phosphor Bronze | 100.0µin (2.54µm) | Phosphor Bronze | |||
|
VIEW |
1,026
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Cut Tape (CT) | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
2,320
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Tape & Reel (TR) | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
1,137
In-stock
|
TE Connectivity Potter & Brumfield Relays | CONN IC DIP SOCKET 32POS TINLEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | - | 32 (2 x 16) | Copper Alloy | - | - | |||
|
VIEW |
2,886
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 28POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
993
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 48POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,203
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 40POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,541
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 28POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,967
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,115
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,987
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,037
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | Gold | 40 (2 x 20) | - | - | - | |||
|
VIEW |
2,834
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | Gold | 28 (2 x 14) | - | - | - | |||
|
VIEW |
1,867
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | Gold | 24 (2 x 12) | - | - | - | |||
|
VIEW |
1,964
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,897
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 28POS TIN | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,492
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,057
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,449
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 28POS TIN | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,947
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Brass |