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23 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | |
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GLOBAL STOCKS | ||||||||||||||||||||||
VIEW |
3,215
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 30POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 30 (2 x 15) | Beryllium Copper | ||||
VIEW |
2,279
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | ||||
VIEW |
3,477
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 16 (2 x 8) | Beryllium Copper | ||||
VIEW |
2,539
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | ||||
VIEW |
3,285
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 24 (2 x 12) | Beryllium Copper | ||||
VIEW |
2,375
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 24 (2 x 12) | Beryllium Copper | ||||
VIEW |
1,749
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | ||||
VIEW |
1,821
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 40 (2 x 20) | Beryllium Copper | ||||
VIEW |
1,977
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | ||||
VIEW |
2,902
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | ||||
VIEW |
863
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | ||||
VIEW |
1,361
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 24 (2 x 12) | Beryllium Copper | ||||
VIEW |
2,853
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | ||||
VIEW |
1,056
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | ||||
VIEW |
966
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 32 (2 x 16) | Beryllium Copper | ||||
VIEW |
3,389
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | Diplomate DL | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Beryllium Copper | ||||
VIEW |
3,922
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | ||||
VIEW |
3,397
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | ||||
VIEW |
1,734
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 24 (2 x 12) | Beryllium Copper | ||||
VIEW |
3,445
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | ||||
VIEW |
614
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 24 (2 x 12) | Beryllium Copper | ||||
VIEW |
1,484
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | Tin | 24 (2 x 12) | Beryllium Copper | ||||
VIEW |
3,968
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | Tin | 40 (2 x 20) | Beryllium Copper |