Contact Finish Thickness - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
115-43-640-41-003000
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RFQ
2,308
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-632-41-001000
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RFQ
2,999
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-632-41-003000
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RFQ
1,661
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-628-41-001000
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VIEW
RFQ
3,119
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-628-41-003000
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VIEW
RFQ
2,345
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-47-640-41-003000
RFQ
VIEW
RFQ
943
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-47-640-41-001000
RFQ
VIEW
RFQ
3,593
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-47-632-41-003000
RFQ
VIEW
RFQ
3,561
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-47-632-41-001000
RFQ
VIEW
RFQ
1,213
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-47-628-41-003000
RFQ
VIEW
RFQ
1,974
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-47-628-41-001000
RFQ
VIEW
RFQ
2,880
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-47-624-41-001000
RFQ
VIEW
RFQ
2,985
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-640-41-001000
RFQ
VIEW
RFQ
2,297
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-624-41-001000
RFQ
VIEW
RFQ
771
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-624-41-003000
RFQ
VIEW
RFQ
2,338
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-648-41-003000
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VIEW
RFQ
1,659
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy