Contact Finish - Mating :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,207
In-stock
3M CONN IC DIP SOCKET 42POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 42 (2 x 21) Beryllium Copper Flash Brass
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1,312
In-stock
3M CONN IC DIP SOCKET 42POS TIN ICO Obsolete Tube -65°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 42 (2 x 21) Phosphor Bronze - Phosphor Bronze
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RFQ
1,522
In-stock
3M CONN IC DIP SOCKET 42POS TIN ICO Obsolete Tube -65°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 42 (2 x 21) Phosphor Bronze - Phosphor Bronze
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2,721
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 42POS TINLEAD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - Tin-Lead 42 (2 x 21) Phosphor Bronze - Phosphor Bronze
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RFQ
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RFQ
2,382
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,516
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
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RFQ
2,780
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 42POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin 60.0µin (1.52µm) Tin 42 (2 x 21) Phosphor Bronze 60.0µin (1.52µm) Phosphor Bronze
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1,242
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 42POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin 60.0µin (1.52µm) Tin 42 (2 x 21) Phosphor Bronze 60.0µin (1.52µm) Phosphor Bronze
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RFQ
655
In-stock
3M CONN IC DIP SOCKET 42POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 42 (2 x 21) Beryllium Copper Flash Brass
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RFQ
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RFQ
3,544
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
2,069
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-642-41-001000
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RFQ
722
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-13-642-41-001000
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VIEW
RFQ
2,274
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 42 (2 x 21) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
116-83-642-41-013101
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VIEW
RFQ
2,875
In-stock
Preci-Dip CONN IC DIP SOCKET 42POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 42 (2 x 21) Beryllium Copper - Brass
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RFQ
1,105
In-stock
Aries Electronics CONN IC DIP SOCKET 42POS GOLD 6556 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 42 (2 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
110-91-642-41-001000
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VIEW
RFQ
2,690
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
116-83-642-41-004101
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VIEW
RFQ
3,807
In-stock
Preci-Dip CONN IC DIP SOCKET 42POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 42 (2 x 21) Beryllium Copper - Brass
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RFQ
VIEW
RFQ
3,281
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
116-87-642-41-011101
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VIEW
RFQ
3,114
In-stock
Preci-Dip CONN IC DIP SOCKET 42POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 42 (2 x 21) Beryllium Copper - Brass
116-83-642-41-008101
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VIEW
RFQ
2,676
In-stock
Preci-Dip CONN IC DIP SOCKET 42POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 42 (2 x 21) Beryllium Copper - Brass
116-83-642-41-002101
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VIEW
RFQ
783
In-stock
Preci-Dip CONN IC DIP SOCKET 42POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 42 (2 x 21) Beryllium Copper - Brass
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RFQ
VIEW
RFQ
3,415
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
116-83-642-41-007101
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VIEW
RFQ
1,300
In-stock
Preci-Dip CONN IC DIP SOCKET 42POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 42 (2 x 21) Beryllium Copper - Brass
116-87-642-41-001101
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VIEW
RFQ
1,125
In-stock
Preci-Dip CONN IC DIP SOCKET 42POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 42 (2 x 21) Beryllium Copper - Brass
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RFQ
VIEW
RFQ
2,427
In-stock
Aries Electronics CONN IC DIP SOCKET 42POS GOLD 6556 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
110-83-642-41-001101
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VIEW
RFQ
1,581
In-stock
Preci-Dip CONN IC DIP SOCKET 42POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 42 (2 x 21) Beryllium Copper - Brass
116-87-642-41-003101
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VIEW
RFQ
3,981
In-stock
Preci-Dip CONN IC DIP SOCKET 42POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 42 (2 x 21) Beryllium Copper - Brass
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RFQ
3,425
In-stock
Preci-Dip CONN IC DIP SOCKET 42POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 42 (2 x 21) Beryllium Copper - Brass
116-87-642-41-018101
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VIEW
RFQ
3,521
In-stock
Preci-Dip CONN IC DIP SOCKET 42POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 42 (2 x 21) Beryllium Copper - Brass
117-83-642-41-005101
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VIEW
RFQ
3,867
In-stock
Preci-Dip CONN IC DIP SOCKET 42POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.070" (1.78mm) Gold 29.5µin (0.75µm) Tin 42 (2 x 21) Beryllium Copper - Brass