Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
A40-LCG-T-R
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1,689
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Assmann WSW Components CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold - Gold 40 (2 x 20) - - -
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3,693
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) - 40 (2 x 20) Copper Alloy - -
840-AG11D-ESL-LF
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RFQ
1,386
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 40 (2 x 20) Beryllium Copper Flash Copper
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RFQ
2,982
In-stock
CNC Tech CONN IC DIP SOCKET 40POS GOLD - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
5-1571552-2
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RFQ
803
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin-Lead 40 (2 x 20) Copper Alloy - Copper Alloy
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RFQ
623
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 40 (2 x 20) Beryllium Copper 25.0µin (0.63µm) Copper
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RFQ
643
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 40 (2 x 20) Copper Alloy - -
840-AG11D
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RFQ
3,581
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 40 (2 x 20) Copper Alloy - Copper Alloy
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RFQ
2,931
In-stock
CNC Tech CONN IC DIP SOCKET 40POS GOLD - Active Tube -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
840-AG11D-ES
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RFQ
3,522
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) Tin-Lead 40 (2 x 20) Copper Alloy - Copper Alloy
540-AG11D-ES
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RFQ
1,905
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Tin-Lead 40 (2 x 20) Copper Alloy - Copper Alloy