Sockets for ICs, Transistors Products For Sale - PDF - Connectors, Interconnects -

Applied Filters :

4 results

Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
GLOBAL STOCKS
	40-C182-30	RFQ VIEW	PDF RFQ	3,221 In-stock	Aries Electronics	CONN IC DIP SOCKET 40POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Surface Mount	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	40 (2 x 20)	Beryllium Copper	200.0µin (5.08µm)	Brass
	40-C182-20	RFQ VIEW	PDF RFQ	894 In-stock	Aries Electronics	CONN IC DIP SOCKET 40POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Surface Mount	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	40 (2 x 20)	Beryllium Copper	200.0µin (5.08µm)	Brass
	40-C300-00	RFQ VIEW	PDF RFQ	888 In-stock	Aries Electronics	CONN IC DIP SOCKET 40POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Surface Mount	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	40 (2 x 20)	Beryllium Copper	200.0µin (5.08µm)	Brass
	40-C212-00	RFQ VIEW	PDF RFQ	3,586 In-stock	Aries Electronics	CONN IC DIP SOCKET 40POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Surface Mount	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	40 (2 x 20)	Beryllium Copper	200.0µin (5.08µm)	Brass

1 / 1

＜Prev Next＞