Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,189
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 48 (2 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
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741
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 48 (2 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
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1,826
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
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3,200
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
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3,111
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
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1,096
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
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1,282
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Aries Electronics CONN IC DIP SOCKET 40POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
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2,566
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Aries Electronics CONN IC DIP SOCKET 40POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
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3,128
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Aries Electronics CONN IC DIP SOCKET 40POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
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1,113
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Aries Electronics CONN IC DIP SOCKET 40POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
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1,525
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Aries Electronics CONN IC DIP SOCKET 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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3,875
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Aries Electronics CONN IC DIP SOCKET 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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3,637
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Aries Electronics CONN IC DIP SOCKET 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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2,641
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Aries Electronics CONN IC DIP SOCKET 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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3,373
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
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1,004
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Aries Electronics CONN IC DIP SOCKET 24POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
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877
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Aries Electronics CONN IC DIP SOCKET 24POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
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3,559
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Aries Electronics CONN IC DIP SOCKET 24POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
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3,527
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Aries Electronics CONN IC DIP SOCKET 24POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
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2,027
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Aries Electronics CONN IC DIP SOCKET 40POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
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2,401
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Aries Electronics CONN IC DIP SOCKET 40POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
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1,958
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Aries Electronics CONN IC DIP SOCKET 24POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
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2,578
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Aries Electronics CONN IC DIP SOCKET 24POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
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1,682
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Aries Electronics CONN IC DIP SOCKET 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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3,102
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Aries Electronics CONN IC DIP SOCKET 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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2,387
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass