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13 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
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VIEW |
617
In-stock
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Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | Brass | |||
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VIEW |
2,480
In-stock
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Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | Brass | |||
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|
VIEW |
1,386
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | Brass | |||
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|
VIEW |
1,476
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | Brass | |||
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|
VIEW |
3,670
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | Brass | |||
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|
VIEW |
851
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | Brass | |||
|
VIEW |
1,274
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | Brass | |||
|
VIEW |
1,462
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | - | 32 (2 x 16) | Beryllium Copper | Brass | |||
|
VIEW |
1,421
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | Brass | |||
|
VIEW |
876
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | - | 32 (2 x 16) | Beryllium Copper | Brass | |||
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|
VIEW |
2,973
In-stock
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Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | Brass | |||
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|
VIEW |
2,877
In-stock
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Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | Brass | |||
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|
VIEW |
2,653
In-stock
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Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | Brass | |||
