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31 results
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
C9122-00
C9122-00
RFQ
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RFQ
3,974
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD Edge-Grip™, C91 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Phosphor Bronze Phosphor Bronze
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C8122-04
RFQ
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RFQ
2,250
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 22 (2 x 11) Phosphor Bronze Phosphor Bronze
Default Photo
22-4503-31
RFQ
VIEW
RFQ
900
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Phosphor Bronze
Default Photo
22-4503-21
RFQ
VIEW
RFQ
1,626
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Phosphor Bronze
Default Photo
22-4513-11
RFQ
VIEW
RFQ
2,575
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4518-10H
RFQ
VIEW
RFQ
1,314
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4508-31
RFQ
VIEW
RFQ
1,259
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4508-21
RFQ
VIEW
RFQ
2,554
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4513-10
RFQ
VIEW
RFQ
1,817
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4513-10T
RFQ
VIEW
RFQ
1,864
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4518-01
RFQ
VIEW
RFQ
3,026
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4513-11H
RFQ
VIEW
RFQ
3,744
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4820-90C
RFQ
VIEW
RFQ
1,352
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4501-31
RFQ
VIEW
RFQ
3,309
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Phosphor Bronze Phosphor Bronze
Default Photo
22-4501-21
RFQ
VIEW
RFQ
722
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Phosphor Bronze Phosphor Bronze
Default Photo
22-4518-10M
RFQ
VIEW
RFQ
649
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4518-11H
RFQ
VIEW
RFQ
1,338
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4511-10
RFQ
VIEW
RFQ
2,934
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 22 (2 x 11) Phosphor Bronze Phosphor Bronze
Default Photo
22-4513-10H
RFQ
VIEW
RFQ
819
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4518-00
RFQ
VIEW
RFQ
3,790
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4518-10T
RFQ
VIEW
RFQ
2,512
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4508-30
RFQ
VIEW
RFQ
1,434
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4508-20
RFQ
VIEW
RFQ
3,160
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4518-10E
RFQ
VIEW
RFQ
3,748
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Brass
22-4518-10
22-4518-10
RFQ
VIEW
RFQ
3,182
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Brass
Default Photo
22-4511-11
RFQ
VIEW
RFQ
1,696
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Phosphor Bronze Phosphor Bronze
Default Photo
22-4503-30
RFQ
VIEW
RFQ
3,608
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Phosphor Bronze
Default Photo
22-4503-20
RFQ
VIEW
RFQ
3,604
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper Phosphor Bronze
Default Photo
22-4501-30
RFQ
VIEW
RFQ
2,483
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 22 (2 x 11) Phosphor Bronze Phosphor Bronze
Default Photo
22-4501-20
RFQ
VIEW
RFQ
2,665
In-stock
 Aries Electronics CONN IC DIP SOCKET 22POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 22 (2 x 11) Phosphor Bronze Phosphor Bronze
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