Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,236
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Harwin Inc. CONN IC DIP SOCKET 22POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 196.9µin (5.00µm) Brass
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1,531
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Assmann WSW Components CONN IC DIP SOCKET 22POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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2,577
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Assmann WSW Components CONN IC DIP SOCKET 22POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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3,431
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3M CONN IC DIP SOCKET 22POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 22 (2 x 11) Beryllium Copper Flash Brass
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1,116
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 22 (2 x 11) Beryllium Copper 25.0µin (0.63µm) Copper
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2,466
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 22 (2 x 11) Beryllium Copper 20.0µin (0.51µm) Copper
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3,458
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3M CONN IC DIP SOCKET 22POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 22 (2 x 11) Beryllium Copper Flash Brass