Contact Finish - Mating :
Contact Finish - Post :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,531
In-stock
Assmann WSW Components CONN IC DIP SOCKET 22POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
1,441
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 22 (2 x 11) Beryllium Copper - Brass
110-93-422-41-801000
RFQ
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RFQ
1,083
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-13-422-41-801000
RFQ
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RFQ
2,782
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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RFQ
1,116
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 22 (2 x 11) Beryllium Copper 25.0µin (0.63µm) Copper
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RFQ
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RFQ
2,466
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 22 (2 x 11) Beryllium Copper 20.0µin (0.51µm) Copper
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RFQ
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RFQ
2,031
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-13-422-41-001000
RFQ
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RFQ
2,216
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-93-422-41-605000
RFQ
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RFQ
1,982
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-422-41-105000
RFQ
VIEW
RFQ
857
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
2,657
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 612 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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RFQ
VIEW
RFQ
1,597
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
VIEW
RFQ
2,373
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
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RFQ
2,831
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
VIEW
RFQ
737
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 22 (2 x 11) Beryllium Copper 25.0µin (0.63µm) Nickel
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RFQ
VIEW
RFQ
1,451
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 22 (2 x 11) Beryllium Copper - Beryllium Copper
116-87-422-41-013101
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VIEW
RFQ
3,574
In-stock
Preci-Dip CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 22 (2 x 11) Beryllium Copper - Brass
116-87-422-41-004101
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VIEW
RFQ
2,522
In-stock
Preci-Dip CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 22 (2 x 11) Beryllium Copper - Brass
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RFQ
VIEW
RFQ
1,117
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
116-83-422-41-001101
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VIEW
RFQ
791
In-stock
Preci-Dip CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 22 (2 x 11) Beryllium Copper - Brass
822-AG11D-ESL-LF
RFQ
VIEW
RFQ
762
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 22 (2 x 11) Beryllium Copper Flash Copper
115-93-422-41-003000
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VIEW
RFQ
1,488
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
116-87-422-41-012101
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VIEW
RFQ
650
In-stock
Preci-Dip CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 22 (2 x 11) Beryllium Copper - Brass
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VIEW
RFQ
3,960
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) - 22 (2 x 11) Copper Alloy - -
110-83-422-41-605101
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VIEW
RFQ
3,677
In-stock
Preci-Dip CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 22 (2 x 11) Beryllium Copper - Brass
110-83-422-41-005101
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VIEW
RFQ
866
In-stock
Preci-Dip CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 22 (2 x 11) Beryllium Copper - Brass
110-99-422-41-001000
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VIEW
RFQ
1,502
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS TINLEAD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
3,120
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
116-83-422-41-013101
RFQ
VIEW
RFQ
857
In-stock
Preci-Dip CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 22 (2 x 11) Beryllium Copper - Brass
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RFQ
VIEW
RFQ
732
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy