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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
GLOBAL STOCKS
	22-4513-11	RFQ VIEW	PDF RFQ	2,575 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	22 (2 x 11)	Beryllium Copper	10.0µin (0.25µm)	Brass
	22-4513-10	RFQ VIEW	PDF RFQ	1,817 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	08-4513-11H	RFQ VIEW	PDF RFQ	2,793 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	8 (2 x 4)	Beryllium Copper	10.0µin (0.25µm)	Brass
	22-4513-10T	RFQ VIEW	PDF RFQ	1,864 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-4513-11H	RFQ VIEW	PDF RFQ	3,744 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	22 (2 x 11)	Beryllium Copper	10.0µin (0.25µm)	Brass
	02-4513-10	RFQ VIEW	PDF RFQ	729 In-stock	Aries Electronics	CONN IC DIP SOCKET 2POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	2 (1 x 2)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-4513-10H	RFQ VIEW	PDF RFQ	819 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	12-4513-10	RFQ VIEW	PDF RFQ	2,016 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Brass
	08-4513-11	RFQ VIEW	PDF RFQ	1,900 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	8 (2 x 4)	Beryllium Copper	10.0µin (0.25µm)	Brass
	10-4513-11H	RFQ VIEW	PDF RFQ	2,117 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	10 (2 x 5)	Beryllium Copper	10.0µin (0.25µm)	Brass
	08-4513-10	RFQ VIEW	PDF RFQ	3,855 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Brass
	08-4513-10T	RFQ VIEW	PDF RFQ	3,891 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Brass
	08-4513-10H	RFQ VIEW	PDF RFQ	3,532 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Brass

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