Packaging :
Contact Finish Thickness - Mating :
Contact Finish - Post :
Number of Positions or Pins (Grid) :
Contact Material - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) - 22 (2 x 11) Copper Alloy - -
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2,040
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 22 (2 x 11) Copper Alloy - -
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1,623
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 22 (2 x 11) Beryllium Copper 25.0µin (0.63µm) Brass, Copper
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 24 (2 x 12) Copper Alloy 80.0µin (2.03µm) Copper Alloy