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76 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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VIEW |
3,236
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 22POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
1,441
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 22 (2 x 11) | Beryllium Copper | - | Brass | |||
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VIEW |
3,431
In-stock
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3M | CONN IC DIP SOCKET 22POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 22 (2 x 11) | Beryllium Copper | Flash | Brass | |||
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VIEW |
3,458
In-stock
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3M | CONN IC DIP SOCKET 22POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 22 (2 x 11) | Beryllium Copper | Flash | Brass | |||
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VIEW |
2,575
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,314
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,574
In-stock
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Preci-Dip | CONN IC DIP SOCKET 22POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 22 (2 x 11) | Beryllium Copper | - | Brass | |||
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VIEW |
1,259
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,554
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,817
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,522
In-stock
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Preci-Dip | CONN IC DIP SOCKET 22POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 22 (2 x 11) | Beryllium Copper | - | Brass | |||
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VIEW |
791
In-stock
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Preci-Dip | CONN IC DIP SOCKET 22POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 22 (2 x 11) | Beryllium Copper | - | Brass | |||
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VIEW |
1,864
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,026
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,342
In-stock
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Preci-Dip | CONN IC DIP SOCKET 22POS GOLD | 612 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 22 (2 x 11) | Beryllium Copper | - | Brass | |||
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VIEW |
1,914
In-stock
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Preci-Dip | CONN IC DIP SOCKET 22POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 22 (2 x 11) | Beryllium Copper | - | Brass | |||
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VIEW |
1,653
In-stock
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Preci-Dip | CONN IC DIP SOCKET 22POS GOLD | 122 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 22 (2 x 11) | Beryllium Copper | - | Brass | |||
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VIEW |
1,953
In-stock
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Preci-Dip | CONN IC DIP SOCKET 22POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 22 (2 x 11) | Beryllium Copper | - | Brass | |||
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VIEW |
650
In-stock
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Preci-Dip | CONN IC DIP SOCKET 22POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 22 (2 x 11) | Beryllium Copper | - | Brass | |||
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VIEW |
3,677
In-stock
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Preci-Dip | CONN IC DIP SOCKET 22POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 22 (2 x 11) | Beryllium Copper | - | Brass | |||
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VIEW |
866
In-stock
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Preci-Dip | CONN IC DIP SOCKET 22POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 22 (2 x 11) | Beryllium Copper | - | Brass | |||
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|
VIEW |
3,744
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
649
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
857
In-stock
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Preci-Dip | CONN IC DIP SOCKET 22POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 22 (2 x 11) | Beryllium Copper | - | Brass | |||
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VIEW |
1,338
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
819
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,658
In-stock
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Preci-Dip | CONN IC DIP SOCKET 22POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 22 (2 x 11) | Beryllium Copper | - | Brass | |||
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VIEW |
2,895
In-stock
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Preci-Dip | CONN IC DIP SOCKET 22POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 22 (2 x 11) | Beryllium Copper | - | Brass | |||
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VIEW |
3,790
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,398
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 22POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 22 (2 x 11) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
