- Termination :
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Applied Filters :
-
- Sockets for ICs, Transistors
- Type : DIP, 0.4" (10.16mm) Row Spacing
- Contact Finish - Mating : Gold
- Mounting Type : Through Hole
- Contact Material - Post : Brass
- Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Number of Positions or Pins (Grid) : 32 (2 x 16)
50 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
1,517
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
661
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,810
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,406
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,116
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.070" (1.78mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,629
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,582
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,971
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
737
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 146 | Active | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,376
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 146 | Active | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,591
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,579
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,023
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 612 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,310
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
772
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.070" (1.78mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,071
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,649
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 121 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,340
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,922
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 122 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,771
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
999
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,398
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,592
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,662
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.070" (1.78mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,040
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
644
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,573
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,266
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,056
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,950
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.070" (1.78mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass |