Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,028
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 121 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,425
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,990
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 104 Active Tube - Through Hole Press-Fit Open Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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1,811
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,390
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,839
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 104 Active Tube - Through Hole Press-Fit Open Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,172
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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1,641
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,320
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 127 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,574
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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914
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,655
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,115
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,099
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,921
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,277
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-13-428-41-001000
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2,982
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,785
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 127 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-428-41-001000
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2,985
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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674
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-43-428-41-005000
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3,319
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,399
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,196
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-93-428-41-005000
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2,033
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy