Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
110-93-432-41-105000
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2,112
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,858
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-422-41-105000
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RFQ
857
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-420-41-105000
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RFQ
3,577
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,556
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-428-41-105000
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RFQ
1,977
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-424-41-105000
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RFQ
2,877
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
2,225
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
2,896
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,117
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-87-424-41-105101
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RFQ
2,091
In-stock
Preci-Dip CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 24 (2 x 12) Beryllium Copper - Brass
114-83-424-41-117101
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RFQ
719
In-stock
Preci-Dip CONN IC DIP SOCKET 24POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper - Brass
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2,304
In-stock
Preci-Dip CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 32 (2 x 16) Beryllium Copper - Brass
114-83-432-41-117101
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RFQ
3,867
In-stock
Preci-Dip CONN IC DIP SOCKET 32POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 32 (2 x 16) Beryllium Copper - Brass
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RFQ
2,358
In-stock
Preci-Dip CONN IC DIP SOCKET 20POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 20 (2 x 10) Beryllium Copper - Brass
110-87-428-41-105101
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RFQ
1,399
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 28 (2 x 14) Beryllium Copper - Brass
114-83-428-41-117101
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VIEW
RFQ
600
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
114-87-420-41-117101
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RFQ
3,511
In-stock
Preci-Dip CONN IC DIP SOCKET 20POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 20 (2 x 10) Beryllium Copper - Brass
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RFQ
3,584
In-stock
Preci-Dip CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper - Brass
110-87-432-41-105101
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RFQ
864
In-stock
Preci-Dip CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 32 (2 x 16) Beryllium Copper - Brass
BU220Z-178-HT
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RFQ
637
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 22POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 22 (2 x 11) Beryllium Copper Flash Brass
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RFQ
2,148
In-stock
Preci-Dip CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 22 (2 x 11) Beryllium Copper - Brass
114-87-424-41-117101
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RFQ
1,414
In-stock
Preci-Dip CONN IC DIP SOCKET 24POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 24 (2 x 12) Beryllium Copper - Brass
114-87-422-41-117101
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RFQ
1,279
In-stock
Preci-Dip CONN IC DIP SOCKET 22POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 22 (2 x 11) Beryllium Copper - Brass
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RFQ
3,312
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
110-87-422-41-105101
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VIEW
RFQ
3,390
In-stock
Preci-Dip CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 22 (2 x 11) Beryllium Copper - Brass
114-87-432-41-117101
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RFQ
1,572
In-stock
Preci-Dip CONN IC DIP SOCKET 32POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 32 (2 x 16) Beryllium Copper - Brass
114-83-422-41-117101
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VIEW
RFQ
1,184
In-stock
Preci-Dip CONN IC DIP SOCKET 22POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 22 (2 x 11) Beryllium Copper - Brass
114-83-420-41-117101
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RFQ
2,103
In-stock
Preci-Dip CONN IC DIP SOCKET 20POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 20 (2 x 10) Beryllium Copper - Brass
114-87-428-41-117101
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RFQ
3,506
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 28 (2 x 14) Beryllium Copper - Brass