Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,182
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold Flash 18 (2 x 9) Copper Alloy 80.0µin (2.03µm) Copper Alloy
123-93-318-41-801000
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2,124
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,465
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,312
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,046
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Aries Electronics CONN IC DIP SOCKET 18POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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1,068
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,960
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,394
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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862
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,738
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,142
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-318-41-105000
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3,510
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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953
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 146 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-318-41-801000
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1,959
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
818-AG11D-ES
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3,939
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 18 (2 x 9) Copper Alloy - Copper Alloy
299-93-318-10-001000
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1,297
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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758
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,986
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,373
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 800 Active Bulk - Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - 18 (2 x 9) Copper Alloy - Copper Alloy
614-93-318-31-012000
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862
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
123-93-318-41-001000
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2,018
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-318-41-001000
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3,481
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,069
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 101 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-318-41-605000
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1,295
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-318-41-001000
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2,562
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,828
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 146 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,807
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,927
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 18 (2 x 9) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
116-93-318-41-007000
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2,502
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
DILB18P-223TLF
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1,287
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Amphenol FCI CONN IC DIP SOCKET 18POS TINLEAD DILB Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 18 (2 x 9) Copper Alloy 100.0µin (2.54µm) Copper Alloy