Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,558
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,608
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-93-652-41-005000
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2,660
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,816
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 127 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,892
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,106
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,430
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-652-41-105000
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875
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,311
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,344
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-99-652-41-001000
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3,198
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS TINLEAD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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928
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,359
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,181
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,210
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-652-41-001000
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1,283
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,877
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,820
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 127 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,483
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,889
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-652-41-001000
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1,042
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy