Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,373
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) 32 (2 x 16) Phosphor Bronze - Phosphor Bronze
110-93-632-41-105000
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3,075
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,684
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 101 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,351
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-632-41-801000
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1,237
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-632-41-605000
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2,809
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,332
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
116-93-632-41-006000
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RFQ
2,159
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,943
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,096
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-632-41-001000
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RFQ
1,962
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
2,075
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-99-632-41-001000
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2,322
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-93-632-10-002000
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2,574
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
111-93-632-41-001000
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RFQ
1,402
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-632-41-001000
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RFQ
1,091
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
1-2199300-2
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729
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TINLEAD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, No Center Bar DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead 60.0µin (1.52µm) 32 (2 x 16) Phosphor Bronze 60.0µin (1.52µm) Brass, Copper
110-99-632-41-001000
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RFQ
3,421
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TINLEAD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
DILB32P-223TLF
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3,070
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Amphenol FCI CONN IC DIP SOCKET 32POS TINLEAD DILB Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 32 (2 x 16) Copper Alloy 100.0µin (2.54µm) Copper Alloy
614-93-632-31-012000
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2,889
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-93-632-41-001000
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RFQ
3,068
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-93-632-41-003000
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RFQ
907
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-93-632-41-001000
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RFQ
2,392
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
214-99-632-01-670800
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2,533
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TINLEAD 214 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy