Number of Positions or Pins (Grid) :
Contact Material - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,842
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA ZIF 989POS GOLD - Obsolete Bulk - Surface Mount Solder Open Frame PGA, ZIF (ZIP) Thermoplastic 0.039" (1.00mm) Gold 15.0µin (0.38µm) Tin-Lead 989 (35 x 36) Copper Alloy 15.0µin (0.38µm) Copper Alloy
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3,858
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA ZIF 989POS GOLD - Obsolete Bulk - Surface Mount Solder Open Frame PGA, ZIF (ZIP) Thermoplastic 0.039" (1.00mm) Gold 15.0µin (0.38µm) Tin-Lead 989 (35 x 36) Copper Alloy 15.0µin (0.38µm) Copper Alloy
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2,601
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 168POS GOLD - Obsolete Bulk - Through Hole Solder Open Frame PGA Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 168 (17 x 17) Beryllium Copper 30.0µin (0.76µm) Brass
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2,750
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 10POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon - Gold - Tin-Lead 10 (Round) Beryllium Copper - Brass
2134146-3
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RFQ
3,101
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 989POS GOLD - Obsolete Cut Tape (CT) - Surface Mount Solder Open Frame PGA Thermoplastic 0.157" (4.00mm) Gold Flash Tin-Lead 989 (35 x 36) Copper Alloy Flash Copper Alloy
2134146-3
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RFQ
2,098
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 989POS GOLD - Obsolete Tape & Reel (TR) - Surface Mount Solder Open Frame PGA Thermoplastic 0.157" (4.00mm) Gold Flash Tin-Lead 989 (35 x 36) Copper Alloy Flash Copper Alloy
2134146-2
RFQ
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RFQ
2,352
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 989POS GOLD - Obsolete Cut Tape (CT) - Surface Mount Solder Open Frame PGA Thermoplastic 0.157" (4.00mm) Gold Flash Tin-Lead 989 (35 x 36) Copper Alloy Flash Copper Alloy
2134146-2
RFQ
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RFQ
2,621
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 989POS GOLD - Obsolete Tape & Reel (TR) - Surface Mount Solder Open Frame PGA Thermoplastic 0.157" (4.00mm) Gold Flash Tin-Lead 989 (35 x 36) Copper Alloy Flash Copper Alloy
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RFQ
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RFQ
1,182
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold Flash Tin-Lead 18 (2 x 9) Copper Alloy 80.0µin (2.03µm) Copper Alloy
2-382468-4
RFQ
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RFQ
2,801
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 15.0µin (0.38µm) Tin-Lead 40 (2 x 20) Phosphor Bronze - Phosphor Bronze
2-382189-2
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RFQ
2,539
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD Diplomate DL Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper - Beryllium Copper
5-1437530-2
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RFQ
1,933
In-stock
TE Connectivity AMP Connectors CONN IC SIP SOCKET 8POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder - SIP Polyester 0.100" (2.54mm) Gold - Tin-Lead 8 (1 x 8) Beryllium Copper - Brass
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RFQ
3,828
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 3POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 3 (1 x 3) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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RFQ
1,373
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Tin-Lead 32 (2 x 16) Phosphor Bronze - Phosphor Bronze
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727
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 123 Obsolete Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-422-41-801000
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RFQ
1,083
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,170
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 241POS GOLD PKA Active Bulk - Through Hole Press-Fit Open Frame PGA Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 241 (18 x 18) Copper Alloy 118.1µin (3.00µm) Phosphor Bronze
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RFQ
3,492
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 28 (2 x 14) Brass 200.0µin (5.08µm) Brass
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2,738
In-stock
Aries Electronics CONN IC DIP SOCKET 48POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 48 (2 x 24) Brass 200.0µin (5.08µm) Brass
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VIEW
RFQ
750
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS GOLD 324 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (1 x 64) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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995
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,359
In-stock
Aries Electronics CONN IC DIP SOCKET 32POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 32 (2 x 16) Brass 200.0µin (5.08µm) Brass
123-93-950-41-001000
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RFQ
3,769
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
2,430
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
123-93-318-41-801000
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RFQ
2,124
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-93-668-41-005000
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RFQ
1,888
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 68POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 68 (2 x 34) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,282
In-stock
Aries Electronics CONN IC DIP SOCKET 24POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 24 (2 x 12) Brass 200.0µin (5.08µm) Brass
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RFQ
2,450
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,429
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
3,558
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy