Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
1,020
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Tin-Lead 200.0µin (5.08µm) 3 (Oval) Beryllium Copper 20.0µin (0.51µm)
Default Photo
RFQ
VIEW
RFQ
3,037
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-3 Phenolic - Tin-Lead 200.0µin (5.08µm) 3 (Oval) Beryllium Copper -
Default Photo
RFQ
VIEW
RFQ
3,683
In-stock
TE Connectivity AMP Connectors CONN TRANSIST TO-3 3POS TIN-LEAD 8060 Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Polytetrafluoroethylene (PTFE) - Tin-Lead - 3 (Oval) Beryllium Copper -
Default Photo
RFQ
VIEW
RFQ
835
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-3 Phenolic - Tin-Lead 200.0µin (5.08µm) 3 (Oval) Beryllium Copper -
8080-1G15
RFQ
VIEW
RFQ
766
In-stock
TE Connectivity AMP Connectors CONN TRANSIST TO-3 3POS TIN-LEAD 8080 Active Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Fluoropolymer (FP) - Tin-Lead 200.0µin (5.08µm) 3 (Oval) Beryllium Copper 200.0µin (5.08µm)