Contact Finish - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
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1,472
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 4POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon, Glass Filled - Gold - 4 (Round) Beryllium Copper Brass
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3,340
In-stock
Harwin Inc. CONN SOCKET SIP 46POS GOLD D01-950 Obsolete Tube -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 46 (1 x 46) Beryllium Copper Brass
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3,835
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Obsolete Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Beryllium Copper Brass
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1,452
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Obsolete Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Beryllium Copper Brass
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2,029
In-stock
Harwin Inc. CONN IC DIP SOCKET 64POS GOLD D73064 Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, Staggered Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.050" (1.27mm) Gold - 64 (2 x 32) Beryllium Copper Brass
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1,547
In-stock
Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper Brass
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3,573
In-stock
Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper Brass
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728
In-stock
Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper Brass
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3,185
In-stock
Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper Brass
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1,890
In-stock
Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper Brass
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1,060
In-stock
Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper Brass
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3,934
In-stock
Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 6 (2 x 3) Beryllium Copper Brass
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1,802
In-stock
Harwin Inc. CONN SOCKET SIP 32POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 32 (1 x 32) Beryllium Copper Brass
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2,149
In-stock
Harwin Inc. CONN SOCKET SIP 20POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 20 (1 x 20) Beryllium Copper Brass
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1,231
In-stock
Harwin Inc. CONN SOCKET SIP 18POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 18 (1 x 18) Beryllium Copper Brass
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3,042
In-stock
Harwin Inc. CONN SOCKET SIP 16POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 16 (1 x 16) Beryllium Copper Brass
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1,236
In-stock
Harwin Inc. CONN SOCKET SIP 14POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 14 (1 x 14) Beryllium Copper Brass
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3,973
In-stock
Harwin Inc. CONN SOCKET SIP 12POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 12 (1 x 12) Beryllium Copper Brass
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3,521
In-stock
Harwin Inc. CONN SOCKET SIP 10POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 10 (1 x 10) Beryllium Copper Brass
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1,362
In-stock
Harwin Inc. CONN SOCKET SIP 9POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 9 (1 x 9) Beryllium Copper Brass
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3,194
In-stock
Harwin Inc. CONN SOCKET SIP 8POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 8 (1 x 8) Beryllium Copper Brass
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1,684
In-stock
Harwin Inc. CONN SOCKET SIP 7POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 7 (1 x 7) Beryllium Copper Brass
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2,955
In-stock
Harwin Inc. CONN SOCKET SIP 6POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 6 (1 x 6) Beryllium Copper Brass
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2,665
In-stock
Harwin Inc. CONN SOCKET SIP 5POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 5 (1 x 5) Beryllium Copper Brass
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1,164
In-stock
Harwin Inc. CONN SOCKET SIP 4POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 4 (1 x 4) Beryllium Copper Brass
SA649000
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3,056
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 64POS GOLD SA Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold Flash 64 (2 x 32) Beryllium Copper Brass
10-18-2031
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3,670
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Molex, LLC CONN SOCKET TRANSIST TO-220 3POS 4038 Obsolete - - Through Hole Solder Closed Frame Transistor, TO-220 Polyester, Glass Filled 0.100" (2.54mm) Tin - 3 (Rectangular) Brass Brass
0009483031
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2,439
In-stock
Molex, LLC CONN SOCKET TRANSIST TO-220 3POS - Obsolete Bulk -40°C ~ 80°C Through Hole Solder Closed Frame Transistor, TO-220 Polyamide (PA66), Nylon 6/6 - Tin 100.0µin (2.54µm) 3 (Rectangular) Brass Brass
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1,050
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Amphenol FCI CONN SOCKET SIP 2POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 2 (1 x 2) Beryllium Copper Brass
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1,421
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Amphenol FCI CONN SOCKET SIP 16POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (1 x 16) Beryllium Copper Brass