Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,962
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Aries Electronics CONN IC DIP SOCKET 10POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (2 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,538
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Aries Electronics CONN IC DIP SOCKET 10POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (2 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,975
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Aries Electronics CONN IC DIP SOCKET 10POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (2 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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616
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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2,997
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
10-28440-10
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2,107
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Aries Electronics CONN IC DIP SOCKET 10POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (2 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
10-2513-10H
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3,953
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
10-2810-90T
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2,426
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Aries Electronics CONN IC DIP SOCKET 10POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (2 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
10-2820-90C
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1,190
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
10-2820-90T
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3,340
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Aries Electronics CONN IC DIP SOCKET 10POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (2 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,320
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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1,746
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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1,049
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
116-43-210-41-006000
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2,885
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,656
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
10-2513-10
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1,737
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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840
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze
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2,298
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze
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1,705
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Aries Electronics CONN IC DIP SOCKET 10POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (2 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,877
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Aries Electronics CONN IC DIP SOCKET 10POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (2 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,822
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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875
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
10-2513-10T
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1,140
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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627
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
10-2810-90C
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3,709
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass