- Part Status :
- Operating Temperature :
- Termination :
- Features :
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
- Contact Material - Mating :
- Contact Material - Post :
- Applied Filters :
63 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
1,531
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 22POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,577
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 22POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,250
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 22 (2 x 11) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,314
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,470
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,381
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,817
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,319
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
3,412
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,864
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,011
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,684
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,377
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,026
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,862
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,571
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,109
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,467
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,721
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,352
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
729
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
649
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,680
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,904
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,089
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 22POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
3,538
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,934
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 22 (2 x 11) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
819
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,245
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,026
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
