- Part Status :
- Packaging :
- Operating Temperature :
- Termination :
- Type :
-
- DIP, 0.2" (5.08mm) Row Spacing (15)
- DIP, 0.3" (7.62mm) Row Spacing (128)
- DIP, 0.4" (10.16mm) Row Spacing (6)
- DIP, 0.6" (15.24mm) Row Spacing (126)
- DIP, 0.9" (22.86mm) Row Spacing (3)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (103)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (142)
- PGA (7)
- PLCC (15)
- SIP (430)
- Transistor, TO-3 (7)
- Housing Material :
-
- Polyamide (PA), Nylon (1)
- Polyamide (PA46), Nylon 4/6 (78)
- Polyamide (PA46), Nylon 4/6, Glass Filled (532)
- Polybutylene Terephthalate (PBT), Glass Filled (5)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (39)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (36)
- Polyphenylene Sulfide (PPS), Glass Filled (255)
- Polytetrafluoroethylene (PTFE) (7)
- Thermoplastic, Polyester (26)
- Thermoplastic, Polyester, Glass Filled (3)
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (17)
- 10 (2 x 5) (18)
- 11 (1 x 11) (7)
- 12 (1 x 12) (11)
- 12 (2 x 6) (4)
- 13 (1 x 13) (6)
- 14 (1 x 14) (9)
- 14 (2 x 7) (51)
- 15 (1 x 15) (12)
- 16 (1 x 16) (10)
- 16 (2 x 8) (30)
- 17 (1 x 17) (11)
- 18 (1 x 18) (9)
- 18 (2 x 9) (24)
- 19 (1 x 19) (9)
- 2 (1 x 2) (14)
- 20 (1 x 20) (61)
- 20 (2 x 10) (25)
- 20 (4 x 5) (2)
- 21 (1 x 21) (7)
- 22 (1 x 22) (5)
- 22 (2 x 11) (10)
- 23 (1 x 23) (5)
- 24 (1 x 24) (6)
- 24 (2 x 12) (46)
- 25 (1 x 25) (23)
- 26 (1 x 26) (8)
- 26 (2 x 13) (2)
- 27 (1 x 27) (10)
- 28 (1 x 28) (8)
- 28 (2 x 14) (46)
- 28 (4 x 7) (2)
- 29 (1 x 29) (7)
- 3 (1 x 3) (8)
- 3 (Oval) (7)
- 30 (1 x 30) (16)
- 30 (2 x 15) (5)
- 31 (1 x 31) (7)
- 32 (1 x 32) (6)
- 32 (2 x 16) (38)
- 32 (2 x 7, 2 x 9) (2)
- 33 (1 x 33) (3)
- 34 (1 x 34) (18)
- 34 (2 x 17) (5)
- 35 (1 x 35) (6)
- 36 (1 x 36) (3)
- 36 (2 x 18) (40)
- 37 (1 x 37) (3)
- 38 (1 x 38) (3)
- 38 (2 x 19) (5)
- 39 (1 x 39) (3)
- 4 (1 x 4) (26)
- 4 (2 x 2) (1)
- 40 (1 x 40) (5)
- 40 (2 x 20) (40)
- 42 (2 x 21) (36)
- 44 (2 x 22) (36)
- 44 (4 x 11) (2)
- 48 (2 x 24) (30)
- 5 (1 x 5) (11)
- 52 (4 x 13) (2)
- 6 (1 x 6) (9)
- 6 (2 x 3) (3)
- 64 (2 x 32) (3)
- 68 (4 x 17) (3)
- 7 (1 x 7) (5)
- 8 (1 x 8) (27)
- 8 (2 x 4) (26)
- 84 (4 x 21) (2)
- 9 (1 x 9) (15)
- Contact Material - Mating :
- Contact Material - Post :
- Applied Filters :
982 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
2,828
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
645
In-stock
|
Amphenol FCI | CONN SOCKET SIP 2POS TIN | - | Obsolete | Tape & Reel (TR) | - | Surface Mount | Solder | Closed Frame | SIP | Polyamide (PA), Nylon | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,455
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,557
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 64POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
993
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 48POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,203
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 40POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,541
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 28POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,967
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,531
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 22POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,153
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,872
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 18POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,557
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 16POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,947
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 14POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,115
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 8POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,107
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
VIEW |
1,099
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
VIEW |
3,376
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,250
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 22 (2 x 11) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
VIEW |
1,887
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
VIEW |
1,624
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
VIEW |
3,753
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 16 (2 x 8) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
VIEW |
3,538
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
VIEW |
3,601
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,784
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,639
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,002
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,595
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,010
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,398
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,180
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
