Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 12POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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2,243
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Aries Electronics CONN SOCKET SIP 12POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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1,172
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Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,899
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Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,933
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Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,894
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Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,259
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Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,036
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Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,038
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Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,840
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Aries Electronics CONN SOCKET SIP 12POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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829
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Aries Electronics CONN SOCKET SIP 12POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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3,481
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Aries Electronics CONN SOCKET SIP 12POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
12-0501-30
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3,099
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Aries Electronics CONN SOCKET SIP 12POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,773
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Aries Electronics CONN SOCKET SIP 12POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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1,041
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Aries Electronics CONN SOCKET SIP 12POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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1,745
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Aries Electronics CONN SOCKET SIP 12POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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2,928
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Aries Electronics CONN SOCKET SIP 12POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass