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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
GLOBAL STOCKS
	22-4518-10H	RFQ VIEW	PDF RFQ	1,314 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-1518-00	RFQ VIEW	PDF RFQ	2,593 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-4518-01	RFQ VIEW	PDF RFQ	3,026 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-4518-10M	RFQ VIEW	PDF RFQ	649 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-4518-00	RFQ VIEW	PDF RFQ	3,790 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-4518-10T	RFQ VIEW	PDF RFQ	2,512 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-1518-10	RFQ VIEW	PDF RFQ	1,035 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-1518-10T	RFQ VIEW	PDF RFQ	2,894 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-4518-10E	RFQ VIEW	PDF RFQ	3,748 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-4518-10	RFQ VIEW	PDF RFQ	3,182 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-1518-10H	RFQ VIEW	PDF RFQ	958 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass

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