Sockets for ICs, Transistors Products For Sale - PDF - Connectors, Interconnects -

Applied Filters :

11 results

Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
GLOBAL STOCKS
	50-9518-10E	RFQ VIEW	PDF RFQ	901 In-stock	Aries Electronics	CONN IC DIP SOCKET 50POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	50 (2 x 25)	Beryllium Copper	200.0µin (5.08µm)	Brass
	64-9518-10E	RFQ VIEW	PDF RFQ	2,794 In-stock	Aries Electronics	CONN IC DIP SOCKET 64POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	64 (2 x 32)	Beryllium Copper	200.0µin (5.08µm)	Brass
	64-9518-10	RFQ VIEW	PDF RFQ	2,817 In-stock	Aries Electronics	CONN IC DIP SOCKET 64POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	64 (2 x 32)	Beryllium Copper	200.0µin (5.08µm)	Brass
	64-9518-10T	RFQ VIEW	PDF RFQ	3,121 In-stock	Aries Electronics	CONN IC DIP SOCKET 64POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	64 (2 x 32)	Beryllium Copper	200.0µin (5.08µm)	Brass
	64-9518-10M	RFQ VIEW	PDF RFQ	3,189 In-stock	Aries Electronics	CONN IC DIP SOCKET 64POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	64 (2 x 32)	Beryllium Copper	200.0µin (5.08µm)	Brass
	50-9518-10M	RFQ VIEW	PDF RFQ	1,905 In-stock	Aries Electronics	CONN IC DIP SOCKET 50POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	50 (2 x 25)	Beryllium Copper	200.0µin (5.08µm)	Brass
	64-9518-10H	RFQ VIEW	PDF RFQ	1,949 In-stock	Aries Electronics	CONN IC DIP SOCKET 64POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	64 (2 x 32)	Beryllium Copper	200.0µin (5.08µm)	Brass
	64-9518-10TE	RFQ VIEW	PDF RFQ	2,660 In-stock	Aries Electronics	CONN IC DIP SOCKET 64POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	64 (2 x 32)	Beryllium Copper	200.0µin (5.08µm)	Brass
	50-9518-10	RFQ VIEW	PDF RFQ	2,545 In-stock	Aries Electronics	CONN IC DIP SOCKET 50POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	50 (2 x 25)	Beryllium Copper	200.0µin (5.08µm)	Brass
	50-9518-10T	RFQ VIEW	PDF RFQ	1,506 In-stock	Aries Electronics	CONN IC DIP SOCKET 50POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	50 (2 x 25)	Beryllium Copper	200.0µin (5.08µm)	Brass
	50-9518-10H	RFQ VIEW	PDF RFQ	3,664 In-stock	Aries Electronics	CONN IC DIP SOCKET 50POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	50 (2 x 25)	Beryllium Copper	200.0µin (5.08µm)	Brass

1 / 1

＜Prev Next＞