Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,897
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Amphenol FCI CONN IC DIP SOCKET 28POS TIN - Obsolete Tube Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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1,449
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS TIN - Obsolete Tube Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,442
In-stock
Amphenol FCI CONN IC DIP SOCKET 16POS TIN - Obsolete Tube Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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1,130
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Amphenol FCI CONN IC DIP SOCKET 24POS TIN - Obsolete Tube Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
3,010
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS TIN - Obsolete Tube Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass