Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
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2,014
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Aries Electronics CONN IC DIP SOCKET 16POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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724
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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3,829
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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1,461
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Aries Electronics CONN IC DIP SOCKET 18POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze
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2,861
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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3,829
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Aries Electronics CONN IC DIP SOCKET 16POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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3,026
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
20-3501-30
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1,685
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Aries Electronics CONN IC DIP SOCKET 20POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (2 x 10) Phosphor Bronze
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3,540
In-stock
Aries Electronics CONN IC DIP SOCKET 20POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (2 x 10) Phosphor Bronze
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2,225
In-stock
Aries Electronics CONN IC DIP SOCKET 20POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (2 x 10) Phosphor Bronze
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3,190
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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2,955
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
1,894
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
1,497
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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1,329
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
3,103
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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1,969
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
3,776
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
2,658
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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1,553
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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918
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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3,120
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
1,752
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
3,645
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
3,113
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
2,847
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
1,825
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
3,518
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
1,731
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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2,611
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze