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21 results
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
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20-3508-30
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RFQ
2,519
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper Brass
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20-3508-20
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RFQ
3,066
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper Brass
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20-4508-30
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RFQ
3,011
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper Brass
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20-4508-20
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RFQ
1,684
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper Brass
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20-71219-10
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RFQ
3,477
In-stock
 Aries Electronics CONN SOCKET SIP 20POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (2 x 10) Phosphor Bronze Phosphor Bronze
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20-3508-301
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RFQ
1,030
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper Brass
Default Photo
20-3508-201
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RFQ
3,272
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper Brass
Default Photo
20-6503-30
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RFQ
848
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper Phosphor Bronze
Default Photo
20-6503-20
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RFQ
2,606
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper Phosphor Bronze
Default Photo
20-3503-30
RFQ
VIEW
RFQ
2,195
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper Phosphor Bronze
Default Photo
20-3503-20
RFQ
VIEW
RFQ
3,246
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper Phosphor Bronze
Default Photo
20-1508-30
RFQ
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RFQ
2,620
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper Brass
Default Photo
20-1508-20
RFQ
VIEW
RFQ
3,104
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper Brass
Default Photo
20-3511-10
RFQ
VIEW
RFQ
2,225
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (2 x 10) Phosphor Bronze Phosphor Bronze
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215-1-20-003
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RFQ
3,355
In-stock
 CNC Tech CONN IC DIP SOCKET 20POS GOLD - Active Tube -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - 20 (2 x 10) Beryllium Copper Brass
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211-1-20-003
RFQ
VIEW
RFQ
2,722
In-stock
 CNC Tech CONN IC DIP SOCKET 20POS GOLD - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper Brass
Default Photo
20-3508-302
RFQ
VIEW
RFQ
3,863
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper Brass
Default Photo
20-3508-202
RFQ
VIEW
RFQ
3,682
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper Brass
Default Photo
20-9503-30
RFQ
VIEW
RFQ
1,820
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper Phosphor Bronze
Default Photo
20-9503-20
RFQ
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RFQ
1,905
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper Phosphor Bronze
Default Photo
20-6511-10
RFQ
VIEW
RFQ
3,442
In-stock
 Aries Electronics CONN IC DIP SOCKET 20POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (2 x 10) Phosphor Bronze Phosphor Bronze
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